Tungsten Rhenium X Ray Anode Target manufacturers tell you that in the electronics industry, based on molybdenum's high melting point, high electrical conductivity, low specific impedance, good corrosion resistance and good environmental performance, molybdenum sputtering targets are widely used in Electrode and wiring materials for flat-panel displays, thin-film solar cells, and barrier materials for semiconductors. Tungsten Rhenium X Ray Anode Target manufacturers tell you that molybdenum sputtering targets are divided into two types according to their shapes, one is a flat plate-shaped target, and the other is a tubular rotating target. In order to improve the sputtering efficiency and ensure the quality of the deposited film, the following requirements are required for the characteristics of the molybdenum sputtering target.

1. Purity
Tungsten Rhenium X Ray Anode Target manufacturers tell you that high purity is a basic characteristic requirement for molybdenum sputtering targets. The higher the purity of the molybdenum target, the better the performance of the sputtering film. Generally, the purity of the molybdenum sputtering target needs to be at least 99.95%.
2. Density
The manufacturer of Tungsten Rhenium X Ray Anode Target tells you that when the sputtering target with less density is bombarded during the sputtering coating process, the gas existing in the internal void of the target is suddenly released, resulting in large-sized target particles or Sputtering particles, or the film is bombarded by secondary electrons after film formation, causing particle splashing. The appearance of these particles will reduce the quality of the film. Therefore, the sputtering target is generally required to have a high density to reduce the lift in the target solid. , to improve the performance of the film. For molybdenum sputtering targets, the relative density should be above 98%.
3. Grain size and size distribution
The molybdenum sputtering target has a polycrystalline structure, and the grain size can range from micrometers to millimeters. The sputtering rate of the fine-grained target is faster than that of the coarse-grained target; and the target with a smaller difference in grain size has a more uniform thickness distribution of the deposited film.
4. Crystal orientation
The manufacturer of Tungsten Rhenium X Ray Anode Target tells you that during sputtering, the atoms of the target material are easily sputtered in the direction of the most densely arranged hexagonal atoms. Therefore, in order to achieve the highest sputtering rate, the crystal structure of the target material is often increased by changing the method. Sputtering rate.
5. Binding of target and chassis
The Tungsten Rhenium X Ray Anode Target manufacturer tells you that the molybdenum sputtering target must be connected to the chassis of oxygen-free copper (or other materials such as aluminum) before sputtering, so that the thermal conductivity between the target and the chassis is in good condition during the sputtering process. After binding, ultrasonic inspection must be carried out to ensure that the unbonded area of ​​the two is less than 2%, so as to meet the requirements of high-power sputtering and not fall off.