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Tantalum target

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Metal target

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Detailed description

产品描述

Commodity name: Tantalum target
Commodity ID: 1443195141010116608

Tantalum sheets and tantalum plates can be used to manufacture various inorganic acid preparation equipment, corrosion-resistant fasteners, supporting accessories, heat shields, heaters and heat sinks in high-temperature vacuum furnaces, water tanks, bridges and other steel Structure of the cathodic protection system.

Product manual

Tantalum, a metallic element, mainly exists in tantalite and co-exists with niobium. The texture of tantalum is very hard, the hardness can reach 6-6.5. Its melting point is as high as 2996℃, second only to tungsten and rhenium, ranking third. Tantalum is malleable and can be drawn into a thin wire-like foil. Its coefficient of thermal expansion is very small. It only expands by 6.6% per degree Celsius. In addition, its toughness is very strong, even better than copper. Tantalum also has extremely high corrosion resistance. It does not react to hydrochloric acid, concentrated nitric acid and "aqua regia" regardless of whether it is under cold or hot conditions.

Application

Tantalum target is usually welded with the copper back target, and then semiconductor or optical sputtering is carried out to deposit tantalum atoms as oxides on the substrate material to achieve sputtering coating. Tantalum targets are mainly used in semiconductor coating, optical coating and other industries. In the semiconductor industry, the metal tantalum (TA) is currently mainly used by physical vapor deposition (PVD) coating and forming a barrier layer as a target. With the rapid development of science and technology, the development of the semiconductor industry is the core of the entire high-tech industry, is a measure of a country's scientific and technological level and innovation ability of the commanding heights, thus by many countries attach great importance to, but also the top priority of technology blockade; At present, the frontier of semiconductor technology is very large scale integrated circuit manufacturing technology.

Standard sizes

Diameter(50-400)mm *Thickness(3-28)mm, customer's special size and requirements can be negotiated

Chemical composition

Brand	Chemical composition ≯%
Brand	Ta	Fe	Si	Ni	W	Mo	Ti	Nb	O	C	H	N
Ta1	Matrix	0.005	0.005	0.005	0.005	0.002	0.002	0.050	0.02	0.004	0.002	0.005
Ta2	Matrix	0.005	0.005	0.005	0.005	0.002	0.002	0.1	0.03	0.010	0.002	0.010
FTa1	Matrix	0.005	0.005	0.005	0.005	0.002	0.002	0.005	0.020	0.003	0.002	0.005
FTa2	Matrix	0.010	0.030	0.010	0.005	0.002	0.002	0.100	0.035	0.003	0.002	0.010
Ta1 and Ta2 are made of ingots, and FTa1 and FTa1 are made of vertical melting bars