High specific gravity tungsten alloy material is a kind of tungsten matrix (W content 85-99%), and add Ni, Cu, Co, Mo, Cr and other elements of the alloy. According to alloy composition characteristics and uses are divided into W-Ni-Fe, W-Ni-Cu, W-Co, W-WC-Cu, W-Ag and other main series, its density is adjustable between 16.5-19.0 g/cm3. General large, shaped parts are produced by isostatic pressing technology, the use of molding, extrusion and injection molding technology to produce small products, the use of forging, rolling production and processing of bars and sheets.

Ruthenium ingots are usually used as alloying element additives to manufacture high-temperature alloys for aviation.

Purity: 99.95%
Ruthenium target is mainly used in the field of vacuum coating

Molybdenum-rhenium alloy is a kind of solid solution alloy with excellent high temperature strength and creep resistance. Rhenium forms β solid solution in molybdenum, with a maximum solubility of 53% (rhenium atoms) at 2250℃. The addition of rhenium changes the mechanical deformation process of pure molybdenum from single sliding to twinning and sliding in hot and cold working, and inhibits the embrittlement of carbon and oxygen, so that the machinability, physical and chemical properties and thermoelectric properties of molybdenum alloy are improved.

High-purity tungsten targets, high-purity tungsten-titanium alloy targets, and tungsten-silicon composite targets are usually applied by magnetron sputtering to produce various complex and high-performance thin film materials. Because high-purity tungsten or ultra-pure tungsten (5N or 6N) has high resistance to electron migration, high temperature stability, and the ability to form stable silicides, it is often used as a thin film in the electronics industry as a gate, connection, transition and Barrier metal. Ultra-high-purity tungsten and its silicides are also used in ultra-large-scale integrated circuits as resistance layers, diffusion barriers, etc., and as gate materials and connection materials in metal oxide semiconductor transistors. Tungsten-titanium alloy sputtering targets are often used to make transition metal layers of thin-film solar cells.

Ir≥99.95%
Size: diameter D (1-20) * height H (10-15) mm; if the buyer has special requirements for size and unit weight, the two parties agree to order

Tungsten-Ni-Cr/Tungsten-Ni-Cr/Ni-Cr targets are mostly used in the special glass coating industry, and the technical specifications can be customized.

Purity: 3N5
Size: 1-10 inches, unconventional size can be customized.

Purity：99.95%，round ,square
Size：diameter Φ50~170mm thickness 3~15mm

Chemical purity: 99.95%
Size: Diameter 20～300mm, thickness 1～60mm, customized according to requirements