At present and in the future, the miniaturization and multi-functionalization of electronic components put forward higher requirements for the heat dissipation of the devices. High-performance heat dissipation (thermal management) materials need to have the characteristics of low density, high thermal conductivity, and thermal expansion matching with semiconductor chip materials, good hardness, and excellent air tightness. Tungsten-copper and molybdenum-copper are often preferred as heat sink materials due to the above advantages. Rheniumet customizes a series of high-quality tungsten copper, molybdenum copper products for users.

Solution advantages

Low density：Low porosity, good air tightness

Higher thermal conductivity：No sintering activation elements are added, maintaining good thermal conductivity

Can be punched into parts：Provide sheets, molded parts, can also meet electroplating needs

Different expansion coefficients：Different expansion coefficients can be designed，Match with different substrates